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Hemlock bags $325M in CHIPS Act funding for polysilicon plant

2025-01-10 eIndustry

The U.S. Department of Commerce has awarded Hemlock Semiconductor (HSC) up to USD 325 million in funding under the CHIPS Incentives Program, to support the construction of a new manufacturing facility…
» Evertiq

Posted in: Uncategorized

Advantest invests in Technoprobe and FormFactor

eIndustry

Semiconductor test equipment supplier Advantest Corporation says it has entered into small minority investments and partnership agreements with both Technoprobe S.p.A. and FormFactor, Inc.
» Evertiq

Posted in: Uncategorized

NXP acquires TTTech Auto for $625 million

eIndustry

NXP is strengthening its automotive business by acquiring TTEch Auto, a software solution provider specialised in the systems, safety and security required for SDVs, in an all-cash transaction valued …
» Evertiq

Posted in: Uncategorized

Compeq opens new PCB manufacturing plant in Thailand

2025-01-09 eIndustry

Taiwanese PCB manufacturer Compeq has recently opened a new PCB manufacturing facility in Thailand, representing an investment of over THB 10.4 billion (EUR 290 million).
» Evertiq

Posted in: Uncategorized

SP Manufacturing expands with new Malaysia plant

eIndustry

Singaporean EMS provider SP Manufacturing (SPM) is upping its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and acquiring the Asian operations of the I…
» Evertiq

Posted in: Uncategorized

‘China for China’ gains momentum among European tech companies

eIndustry

Geopolitical dynamics are accelerating the formation of the “China for China” supply chain, driven by China’s vast domestic market. This trend is particularly evident in the automotive sector, s…
» Evertiq

Posted in: Uncategorized

CN Rood expands partnership with Tektronix

2025-01-08 eIndustry

High-tech test and measurement solutions distributor CN Rood is expanding its partnership with Tektronix to include Denmark, Norway, and Finland.
» Evertiq

Posted in: Uncategorized

Micron breaks ground on new $7B HBM advanced packaging facility

eIndustry

Micron Technology has started construction on a new High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, near its existing operations.
» Evertiq

Posted in: Uncategorized

Hanmi Semiconductor breaks ground on seventh plant

eIndustry

On January 6, 2025, Hanmi Semiconductor broke ground on its seventh plant, which will focus on High Bandwidth Memory (HBM) TC Bonder.
» Evertiq

Posted in: Uncategorized

XIVER takes over Philips’ MEMS foundry

eIndustry

The MEMS foundry at the High Tech Campus Eindhoven, will remain in Dutch hands. The former Philips unit will continue as an independent company and will be named XIVER, following a divestment to a con…
» Evertiq

Posted in: Uncategorized

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