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Gémosz expands technologically and physically

2023-02-03 eIndustry

Over the last few years, the Hungarian EMS provider has recorded business growth of above 25% on average.
» Evertiq

Posted in: Uncategorized

Infineon ends 1Q23 on a high note – raises its outlook

eIndustry

“Infineon is staying on course in choppy waters, and the first quarter of our 2023 fiscal year has been very profitable. Substantial parts of our business have proved robust even in a weaker macroeco…
» Evertiq

Posted in: Uncategorized

Is there still a chip shortage?

eIndustry

Depending on who you ask, and the focus of that company, you will get different answers. But in general, the short answer is; No.
» Evertiq

Posted in: Uncategorized

Integra selects Kansas for OSAT semiconductor project

eIndustry

U.S. Outsourced Semiconductor Assembly and Test (OSAT) company, Integra Technologies and Kansas Governor Laura Kelly jointly announced that the State of Kansas approved Integra’s Attracting Powerful …
» Evertiq

Posted in: Uncategorized

ASM to invest $100 million in Korean operations

eIndustry

ASM says that it intends to invest around USD 100 million in its manufacturing and innovation center in Dongtan, South Korea, by 2025, following the signing of a Memorandum of Understanding between AS…
» Evertiq

Posted in: Uncategorized

Marelli wins a major BMS supply contract

eIndustry

Marelli has been awarded an important contract to supply its Battery Management System (BMS) to an unnamed major global carmaker, from 2026.
» Evertiq

Posted in: Uncategorized

MACOM to acquire assets and operations from OMMIC SAS

eIndustry

MACOM Technology Solutions has entered into a definitive agreement – via one of its French subsidiaries – to acquire the assets and operations of French semiconductor manufacturer OMMIC SAS for EU…
» Evertiq

Posted in: Uncategorized

TopLine installs Hentec/RPS system

2023-02-02 eIndustry

TopLine Corporation has installed a Hentec/RPS Odyssey 1750 robotic hot solder dip component lead tinning system at their Orange, California facility.
» Evertiq

Posted in: Uncategorized

LG Innotek prepares for mass production of FC-BGA substrates

eIndustry

The South Korean company is gearing up for mass production of flip chip ball grid array (FC-BGA) substrates in the fourth quarter of 2023, accelerating its push into the high-end substrate market.
» Evertiq

Posted in: Uncategorized

Western Digital gets $900 million investment

eIndustry

Memory chip maker Western Digital says that it will receive USD 900 via a convertible preferred stock deal from Apollo Global Management and Elliott Investment Management.
» Evertiq

Posted in: Uncategorized

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